High-Performance 1U Copper Skived Fin CPU Cooler for Intel LGA 1700 - Reliable China Suppliers & Factory
| Part Number | SD-1700-1U1C | Hole Distance | 78*78mm |
| CPU Socket | Intel LGA1700 | Fin Thickness | 0.3mm |
| Server Platform | 1U | Fin Pitch | 2.4mm |
| Heatsink Dimension | 88mm*88mm*25mm | Material | Copper |
| TDP | 125W | Cooling Type | Passive |
Crafted with precision and expertise, our CPU coolers are designed with turned copper to maximize surface area for efficient heat transfer. This innovative structure enhances thermal conductivity, effectively drawing heat away from the CPU to prevent overheating and maintain optimal performance.
Our heatsinks are designed specifically for the Intel LGA 1700 socket, providing a seamless, secure fit ensuring compatibility and reliable thermal performance. Its 1U form factor makes it ideal for space-constrained environments such as rack servers and compact computing systems without compromising cooling efficiency.
The passive cooling design requires no additional power consumption or noisy fans, providing a quiet and energy-efficient solution for CPU cooling. This makes it ideal for applications requiring low noise levels and minimal power consumption.
Whether you’re a professional system builder, IT manager or an enthusiast looking to optimize your computing setup, our CPU coolers provide a reliable, high-performance cooling solution. Its durable construction and efficient cooling capabilities make it suitable for demanding workloads, gaming, content creation, and other intensive computing tasks.
Sinda Thermal can offer professional thermal design, thermal simulation for the NPI stage;
Sinda thermal can manufacture wide range of heat sinks such as standard CPU cooler and customized heat sinks;
Sinda Thermal provides excellent after-sale service, we will respond all the questions from customer.










Mr. Perry Wu International Sales Director



