Mr. Perry Wu International Sales Director
China Suppliers | Intel LGA4677 1U Passive CPU Cooler from Trusted Factory for Optimal CPU Performance
Product Basic Parameters
| Part Number | SD-4677-1UM71-P | Fin Thickness | 0.3mm |
| CPU Socket | LGA4677 | Fin Pitch | 1.5mm |
| Server Platform | 1U | Heat sink material | Copper & Aluminum Base+ Aluminum Fin+4 heatpipes |
| Overall Dimension | 118mm*78mm*25.3mm | TIMs | Shin-ETSU,7921 or DOW CORNING,TC-5888 grease |
| TDP | 205W | Cooling Type | Passive |
Product Highlights
Why choose this 1U CPU cooler for Intel LGA4677 socket?
The best advantages of the Intel LGA4677 1U Passive CPU Cooler is its efficient cooling capabilities. Designed specifically for 1U server systems, this cooler is ideal for compact and space-constrained environments. Despite its compact size, it effectively dissipates the heat generated by the CPU, ensuring that the processor operates within a safe temperature range.
The benefits of the heat sink design
The passive design of this CPU cooler means it operates quietly, making it an excellent choice for environments where noise levels need to be kept to a minimum. This is especially important in server rooms or data centers where multiple systems are running simultaneously.
In addition to cooling performance, the Intel LGA4677 1U Passive CPU Cooler is designed for easy installation, making it a convenient choice for system builders and IT professionals. Its compatibility with the Intel LGA4677 socket ensures it can be seamlessly integrated into a variety of server configurations.
Our Service
Sinda Thermal can offer professional thermal design, thermal simulation for the NPI stage;
Sinda thermal can manufacture wide range of heat sinks such as standard CPU cooler and customized heat sinks;
Sinda Thermal provides excellent after-sale service, we will respond all the questions from customer.
Our Certificates
Frequently Asked Questions
What is the TDP capacity of this LGA4677 1U CPU Cooler?
This passive CPU cooler supports a Thermal Design Power (TDP) of up to 205W, making it suitable for high-performance server processors within compact 1U environments.
Which CPU socket and server platforms is this product designed for?
It is specifically designed for Intel LGA4677 CPU sockets and is optimized for space-constrained 1U server platforms.
What materials are used in the construction of this heat sink?
The heat sink features a high-performance hybrid design combining a Copper & Aluminum Base, Aluminum Fins (0.3mm thickness, 1.5mm pitch), and 4 integrated heat pipes for superior thermal conductivity.
What Thermal Interface Material (TIM) is pre-applied?
This cooler utilizes industry-leading thermal greases, specifically Shin-Etsu 7921 or Dow Corning TC-5888, to ensure minimal thermal resistance between the CPU and the cooler base.
Does Sinda Thermal support customized heat sink designs?
Yes. Sinda Thermal offers professional thermal design, simulation services during the NPI stage, and manufactures a wide range of standard as well as customized thermal management solutions.