Mr. Perry Wu International Sales Director
Hot Products
China Suppliers Factory Liquid Cooling Solution for NVIDIA B200 Blackwell GPU - Maximize Performance & Efficiency
Key Features & Benefits
1. Superior Thermal Performance
• Direct-to-Chip (D2C) liquid cooling efficiently removes heat from the B200 GPU, preventing thermal throttling.
• Supports up to 1000W+ TDP, making it ideal for the most demanding AI and supercomputing tasks.
2. Energy-Efficient Operation
• Reduces cooling power consumption by up to 40% compared to traditional air cooling.
• Lowers data center PUE (Power Usage Effectiveness), improving overall energy efficiency.
3. High-Density GPU Deployments
• Enables tighter server rack configurations, allowing more B200 GPUs per unit space.
• Ideal for AI clusters, cloud computing, and exascale supercomputers.
4. Silent & Reliable
• Eliminates noisy fan cooling, making it perfect for edge deployments and office-adjacent data centers.
• Extends hardware lifespan by maintaining stable operating temperatures.
5. Scalable & Modular Design
• Compatible with NVIDIA DGX B200, HGX B200, and OVX systems.
• Supports rack-level liquid cooling integration for seamless data center adoption.
Industry-Leading Applications
The NVIDIA B200 Liquid Cooling System is engineered for:
AI & Machine Learning – Stable cooling for large-scale LLM training (e.g., ChatGPT, Claude, Gemini).
High-Performance Computing (HPC) – Supports scientific simulations, weather modeling, and quantum research.
Cloud & Hyperscale Data Centers – Reduces operational costs while increasing GPU density.
Enterprise AI Deployments – Ideal for NVIDIA DGX & HGX systems in private AI clouds.
Why Choose Liquid Cooling for the B200?
| Feature | Air Cooling | Liquid Cooling |
| Heat Dissipation | Limited | Ultra-Efficient |
| Power Efficiency | High PUE | Lower PUE (More Sustainable) |
| Noise Levels | Loud (Fans) | Near-Silent |
| GPU Density | Restricted | High (More GPUs/Rack) |
| Hardware Longevity | Moderate | Extended Lifespan |
Deployment & Availability
• NVIDIA’s DGX & HGX platform partners (Dell, HPE, Lenovo, Supermicro)
• Liquid cooling specialists (CoolIT Systems, Asetek, GRC, Submer)
• Hyperscale cloud providers (AWS, Microsoft Azure, Google Cloud)
Our Service
01
Sinda Thermal can offer professional thermal design, thermal simulation for the NPI stage;
02
Sinda Thermal can manufacture wide range of heat sinks such as standard CPU cooler and customized heat sink
03
Sinda Thermal provides excellent after-sale service, we will respond all the questions from customer.
Our Certificates
ISO14001 2021
ISO19001 2016
ISO45001 2021
IATF16949
FAQ
01. Is it possible to have some design optimization on the heatsink if customer needs?
Yes, Sinda Thermal provide customization service to all customer's needs with lower cost.
02. What's the MOQ for this heatsink?
We can quote base on different MOQ as per customer needs.
03. Do we still need to pay for the tooling cost for this standard parts?
The standard heatsink is developed by Sinda and sell to all customers, no tooling charge cost.
04. How long is the LT?
We have some finished good or raw material in stock , for sample demand , we can finish in 1 week ,and 2-3 weeks for mass production.
05. Is it possible to have some design optimization on the heatsink if customer needs?
Yes, Sinda Thermal provide customization service to all customer’s needs with lower cost.