China Suppliers Factory for NVIDIA B200 Liquid Cooling Solution - Optimize Performance of Blackwell GPU
Key Features & Benefits
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1. Superior Thermal PerformanceDirect-to-Chip (D2C) liquid cooling efficiently removes heat from the B200 GPU, preventing thermal throttling. Supports up to 1000W+ TDP, making it ideal for the most demanding AI and supercomputing tasks.
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2. Energy-Efficient OperationReduces cooling power consumption by up to 40% compared to traditional air cooling. Lowers data center PUE (Power Usage Effectiveness), improving overall energy efficiency.
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3. High-Density GPU DeploymentsEnables tighter server rack configurations, allowing more B200 GPUs per unit space. Ideal for AI clusters, cloud computing, and exascale supercomputers.
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4. Silent & ReliableEliminates noisy fan cooling, making it perfect for edge deployments and office-adjacent data centers. Extends hardware lifespan by maintaining stable operating temperatures.
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5. Scalable & Modular DesignCompatible with NVIDIA DGX B200, HGX B200, and OVX systems. Supports rack-level liquid cooling integration for seamless data center adoption.
Industry-Leading Applications
The NVIDIA B200 Liquid Cooling System is engineered for:
- ✔ AI & Machine Learning – Stable cooling for large-scale LLM training (e.g., ChatGPT, Claude, Gemini).
- ✔ High-Performance Computing (HPC) – Supports scientific simulations, weather modeling, and quantum research.
- ✔ Cloud & Hyperscale Data Centers – Reduces operational costs while increasing GPU density.
- ✔ Enterprise AI Deployments – Ideal for NVIDIA DGX & HGX systems in private AI clouds.
Why Choose Liquid Cooling for the B200?
| Feature | Air Cooling | Liquid Cooling |
|---|---|---|
| Heat Dissipation | Limited | Ultra-Efficient |
| Power Efficiency | High PUE | Lower PUE (More Sustainable) |
| Noise Levels | Loud (Fans) | Near-Silent |
| GPU Density | Restricted | High (More GPUs/Rack) |
| Hardware Longevity | Moderate | Extended Lifespan |
Deployment & Availability
The NVIDIA B200 Liquid Cooling System is available through:
- NVIDIA’s DGX & HGX platform partners (Dell, HPE, Lenovo, Supermicro)
- Liquid cooling specialists (CoolIT Systems, Asetek, GRC, Submer)
- Hyperscale cloud providers (AWS, Microsoft Azure, Google Cloud)
Our Service
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Sinda Thermal can offer professional thermal design, thermal simulation for the NPI stage;
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Sinda Thermal can manufacture wide range of heat sinks such as standard CPU cooler and customized heat sink.
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Sinda Thermal provides excellent after-sale service, we will respond all the questions from customer.
Our Certificates
ISO14001 2021
ISO19001 2016
ISO45001 2021
IATF16949
Frequently Asked Questions
Q1Is it possible to have some design optimization on the heatsink if customer needs?
Yes, Sinda Thermal provide customization service to all customer's needs with lower cost.
Q2What's the MOQ for this heatsink?
We can quote base on different MOQ as per customer needs.
Q3Do we still need to pay for the tooling cost for this standard parts?
The standard heatsink is developed by Sinda and sell to all customers, no tooling charge cost.
Q4How long is the LT?
We have some finished good or raw material in stock , for sample demand , we can finish in 1 week ,and 2-3 weeks for mass production.
Q5Is it possible to have some design optimization on the heatsink if customer needs?
Yes, Sinda Thermal provide customization service to all customer’s needs with lower cost.






Mr. Perry Wu International Sales Director
