Mr. Perry Wu International Sales Director
1U EVAC CPU Heat Sink for Intel LGA 4677 - Quality Cooling Solutions from China Suppliers and Factory
Product Basic Parameters
| Part Number | SD-4677-1UM85-P | Fin Thickness | 0.3mm |
| CPU Socket | Intel 4677 Series | Fin Pitch | 1.5mm |
| Server Platform | 1U Server | Screw Hole Distance | 102.5mm*57.6mm |
| Heatsink Dimension | 169*157.3*25mm | Heatsink Material | Copper & Aluminum Base / Aluminum Zipper Fin / Copper heatpipes / Intel Standard Hardware |
| TDP | 250W | TIMs | Shin-ETSU, 7921 or DOW CORNING, TC-5888 grease |
Product Introduction
The primary function of a CPU heat sink is to absorb and dissipate the heat generated by the CPU. In the case of the 1U EVAC CPU heat sink, its design is specifically tailored for the 1U form factor, making it ideal for space-constrained server environments. The heat sink is engineered to fit within the limited vertical space of a 1U server chassis while effectively cooling the CPU.
The Intel LGA 4677 socket is designed for high-performance server processors, and as such, it requires a robust cooling solution to ensure optimal thermal performance. The 1U EVAC CPU heat sink is equipped to meet these demands, featuring a combination of heat pipes, aluminum fins, and remote fins to efficiently dissipate heat away from the CPU.
In addition to its cooling capabilities, the 1U EVAC CPU heat sink is designed for easy installation and maintenance. Its compact form factor and lightweight construction make it easy to handle during installation, while its durable build ensures long-term reliability.
Our Service
Sinda Thermal can offer professional thermal design, thermal simulation for the NPI stage;
Sinda thermal can manufacture wide range of heat sinks such as standard CPU cooler and customized heat sinks;
Sinda Thermal provides excellent after-sale service, we will respond all the questions from customer.
Our Certificates
ISO14001 2021
ISO19001 2016
ISO45001 2021
