1U EVAC CPU Heat Sink for Intel LGA 4677 - High-Performance Cooling Solution from China Suppliers & Factory
Product Basic Parameters
| Part Number | SD-4677-1UM85-P | Fin Thickness | 0.3mm |
| CPU Socket | Intel 4677 Series | Fin Pitch | 1.5mm |
| Server Platform | 1U Server | Screw Hole Distance | 102.5mm*57.6mm |
| Heatsink Dimension | 169*157.3*25mm | Heatsink Material | Copper & Aluminum Base/ Aluminum Zipper Fin/ Copper heatpipes/ Intel Standard Hardware |
| TDP | 250W | TIMs | Shin-ETSU,7921 or DOW CORNING,TC-5888 grease |
Product Introduction
01. Primary Function
The primary function of a CPU heat sink is to absorb and dissipate the heat generated by the CPU. In the case of the 1U EVAC CPU heat sink, its design is specifically tailored for the 1U form factor, making it ideal for space-constrained server environments. The heat sink is engineered to fit within the limited vertical space of a 1U server chassis while effectively cooling the CPU.
02. Thermal Performance
The Intel LGA 4677 socket is designed for high-performance server processors, and as such, it requires a robust cooling solution to ensure optimal thermal performance. The 1U EVAC CPU heat sink is equipped to meet these demands, featuring a combination of heat pipes, aluminum fins, and remote fins to efficiently dissipate heat away from the CPU.
03. Installation & Maintenance
In addition to its cooling capabilities, the 1U EVAC CPU heat sink is designed for easy installation and maintenance. Its compact form factor and lightweight construction make it easy to handle during installation, while its durable build ensures long-term reliability.
Our Service
01. Thermal Design
Sinda Thermal can offer professional thermal design, thermal simulation for the NPI stage;
02. Manufacturing
Sinda thermal can manufacture wide range of heat sinks such as standard CPU cooler and customized heat sinks;
03. After-Sale Support
Sinda Thermal provides excellent after-sale service, we will respond all the questions from customer.
Our Certificates

ISO14001 2021

ISO19001 2016

ISO45001 2021

IATF16949
Frequently Asked Questions
Q: Is it possible to have some design optimization on the heatsink if customer needs?
Yes, Sinda Thermal provide customization service to all customer's needs with lower cost.
Q: What's the MOQ for this heatsink?
We can quote base on different MOQ as per customer needs.
Q: Do we still need to pay for the tooling cost for this standard parts?
The standard heatsink is developed by Sinda and sell to all customers, no tooling charge cost.
Q: How long is the lead time (LT)?
We have some finished good or raw material in stock. For sample demand, we can finish in 1 week, and 2-3 weeks for mass production.
Q: What is the TDP capability of this 1U CPU heatsink?
This heatsink is designed to support a TDP (Thermal Design Power) up to 250W.
Q: What materials are used for this heatsink construction?
It is made of a Copper & Aluminum Base, Aluminum Zipper Fin, Copper heatpipes, and comes with Intel Standard Hardware.






Mr. Perry Wu International Sales Director




